Barrow PHCD-PA Semiconductor (Peltier) Rapid Phone Cooler with Heat-Sink Fan Radiator for Gaming Smartphones, USB 5V

Barrow PHCD-PA Semiconductor (Peltier) Rapid Phone Cooler with Heat-Sink Fan Radiator for Gaming Smartphones, USB 5V

TL;DR: The PHCD-PA is a clip-on phone cooler that uses a thermoelectric (Peltier) module backed by an aluminum heatsink and a small fan to actively pull heat off the rear of a phone during long mobile gaming sessions, livestreaming or benchmarking. The spring clamp is sized for phones 65 to 80 mm wide and...

Common Applications

The PHCD-PA is a clip-on phone cooler that uses a thermoelectric (Peltier) module backed by an aluminum heatsink and a small fan to actively pull heat off the rear of a phone during long mobile gaming sessions, livestreaming or benchmarking. The spring clamp is sized for phones 65 to 80 mm wide and up to 9.5 mm thick, which covers most modern flagships without a thick case. Power is delivered over a USB cable, and the device needs a 5V supply rated at 2A or higher to drive the Peltier under load. Some condensation on the cold plate is normal during use; do not run the cooler with no phone attached, as the trapped cold side can damage the module.

Frequently Asked Questions

Q: What phone sizes does the PHCD-PA fit?

A: Phones 65 to 80 mm wide and up to 9.5 mm thick. Bulky cases must be removed first.

Q: What power supply do I need?

A: 5V USB power at 2A or higher. Lower-current adapters or PC USB ports may underdrive the Peltier.

Q: Why is there condensation on the cooler?

A: The semiconductor module makes the contact plate colder than ambient, which causes humid air to condense. This is normal.

Q: Can I leave it powered on without a phone?

A: No. Running it without thermal load can permanently damage the cooling element. Power it off when not clipped to a phone.

Q: How does it attach?

A: A spring-loaded clip grips the back of the phone. No adhesive or magnets are required.