Bykski
Dow Corning TC-5688 8.0 W/mK Silicone Thermal Grease, Pump-Out Resistant Compound for CPU and GPU, 3g Tube
Dow Corning TC-5688 8.0 W/mK Silicone Thermal Grease, Pump-Out Resistant Compound for CPU and GPU, 3g Tube
TL;DR: TC-5688 is a silicone-based, non-curing thermal grease rated by Dow Corning at 8.0 W/mK. It was originally developed in collaboration with Intel for mobile microprocessor packages and is engineered around resistance to pump-out, the cyclic squeeze-and-relax behavior under repeated heating that...
Common Applications
TC-5688 is a silicone-based, non-curing thermal grease rated by Dow Corning at 8.0 W/mK. It was originally developed in collaboration with Intel for mobile microprocessor packages and is engineered around resistance to pump-out, the cyclic squeeze-and-relax behavior under repeated heating that causes ordinary pastes to migrate out from between the die and IHS. The compound is non-electrically-conductive, stable across long service intervals, and applies cleanly to CPU and GPU IHS surfaces. The 3g tube is sized for several standard CPU or GPU repastes.
Frequently Asked Questions
Q: What is the rated thermal conductivity?
A: Manufacturer-rated 8.0 W/mK. This is below boutique pastes like Kryonaut, but TC-5688's value is in long-term stability rather than peak short-term conductivity.
Q: Is TC-5688 electrically conductive?
A: No. It is a silicone-based, non-conductive compound and safe in contact with PCB components.
Q: What makes it 'pump-out resistant'?
A: The silicone polymer formula is engineered to stay in place under repeated heat-cool cycles, instead of slowly migrating out from between die and IHS the way many consumer pastes do.
Q: How long does it last between repastes?
A: Several years in typical desktop service before measurable degradation, thanks to the pump-out resistance and low oil separation.
Q: How is it applied?
A: A small pea-sized drop in the center of a clean IHS, then spread by mounting pressure. Avoid pre-spreading - voids reduce real-world conductivity.
