Astralcooler
Astralcooler All-in-one server GPU cooler radiator 360/480, compatible with NVIDIA CMP 170HX/A100 40GB/A30 24GB
FormulaMod Official Store
Compatible Platforms (with attached image)
-
NVIDIA A100 40GB
NVIDIA CMP 170HX
NVIDIA A30 24GB
NVIDIA A100 40GB
NVIDIA CMP 170HX
NVIDIA A30 24GB
Cooling Location
- High-heat-generating components such as the GPU core, memory, power MOSFETs, inductors, and tantalum capacitors.
Cooling Principle
- The high-purity oxygen-free copper baseplate of the graphics card's water block covers key high-heat-generating components, including the GPU core, memory, power MOSFETs, and tantalum capacitors. The heat absorbed by the water block is then carried away by the flowing coolant.
Block Features
- High Thermal Conductivity：
- The baseplate is made of T2 oxygen-free copper, with a thermal conductivity of up to 401 W/m·K, improving heat transfer efficiency and increasing the heat dissipation area.
- High-Density Jet Microchannel Design：
- The expanded water channel area effectively increases the contact area between the coolant and the base plate, comprehensively improving the heat dissipation performance of the water block.
- All-Metal Chassis：
- The all-metal chassis ensures efficient heat dissipation and stability while significantly extending the lifespan of the hardware, providing a solid foundation for high-load operation
- Lightweight Design：
- Reduces the weight of the water block, preventing PCB deformation. A more reliable passivation process ensures faster heat conduction while effectively resisting corrosion and wear.
- No copper-aluminum reaction will occur：
- The cold head has a nickel-plated copper surface, the radiator has a hard anodized aluminum surface where it comes into contact with water, and the coolant has a formula to inhibit the copper-aluminum reaction. These three elements combined prevent the copper-aluminum reaction.
- The baseplate is made of T2 oxygen-free copper, with a thermal conductivity of up to 401 W/m·K, improving heat transfer efficiency and increasing the heat dissipation area.
- The expanded water channel area effectively increases the contact area between the coolant and the base plate, comprehensively improving the heat dissipation performance of the water block.
- The all-metal chassis ensures efficient heat dissipation and stability while significantly extending the lifespan of the hardware, providing a solid foundation for high-load operation
- Reduces the weight of the water block, preventing PCB deformation. A more reliable passivation process ensures faster heat conduction while effectively resisting corrosion and wear.
- No copper-aluminum reaction will occur：
- The cold head has a nickel-plated copper surface, the radiator has a hard anodized aluminum surface where it comes into contact with water, and the coolant has a formula to inhibit the copper-aluminum reaction. These three elements combined prevent the copper-aluminum reaction.
