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Barrow TBBZQ, Expansion Backplane Components For Intel CPU block, For Intel Lga115x/

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Product Description:

115X platform for cold head enhanced backplane components Through the self-adhesive enhanced backplane components, can enhance the overall capacity of the cold head, the main purpose to deal with part of the whole metal heavy head can be balanced when the motherboard back PCB tension Material: 1.5MM carbon steel Accessories: double - sided insulation stickers * 2

Barrow TBBZQ, Expansion Backplane Components For Intel CPU block, For Intel Lga115x/  Barrow TBBZQ, Expansion Backplane Components For Intel CPU block, For Intel Lga115x/  Barrow TBBZQ, Expansion Backplane Components For Intel CPU block, For Intel Lga115x/  
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